“Jingtai Optoelectronics was established in 2008. In 2010, the company’s revenue exceeded 100 million yuan. In 2011, its revenue doubled. For 2012, as early as the year ago, Jingtai Optoelectronics set a year-end goal and strived for an output value of 300 million. In an exclusive interview with Gaogong LED, Gong Wen, general manager of Jingtai Optoelectronics, described the grand blueprint for the future development of Jingtai Optoelectronics.
The goal of high-speed growth has brought a steady flow of momentum to the company. Jingtai Optoelectronics has begun a non-stop expansion. According to the previous plan, this year the company will increase its monthly production capacity from 400KK last year to 600KK. However, in view of the ever-increasing volume of orders, the company has already completed its scheduled expansion target as early as June.
“The orders are constantly flowing, even if the capacity of 600KK is no longer satisfied. Jingtai Optoelectronics plans to expand 200KK, so the company's monthly production capacity will reach 800KK or more. The newly added capacity will be mainly invested in the rapid growth of LED lighting and automotive lighting devices. Gong Wen said that for the LED display device that the company started, Jingtai Optoelectronics will maintain the steady development of the display, but its share of the company's revenue contribution will gradually decline in the future.
LED display, LED lighting, 3C products (automotive lighting will be the main product in 3C products) are the company's three major development directions in the future. Gong Wen defines these three development directions as the “three troikas†that drive the company's rapid growth. .
At the 2012 High-Tech LED Show, Jingtai Optoelectronics will present its new MLCOB series this year - the third generation of MLCOB packaging products and medium power surface mount LEDs.
Among them, MLCOB adopts high-power packaging technology with ultra-low thermal resistance. Compared with traditional devices, MLCOB has high heat dissipation rate and effectively reduces light decay. It can optimize the application of lighting manufacturers, compact design and more flexible lighting design.
The medium-power surface-mount LED chip adopts high-power back-plating aluminum process, and the heat dissipation is more direct; the light-emitting area is large, the light-emitting angle is large, and the light is uniform; and the light transmittance of 10% is increased, and the light-transmitting cover of 85-95% can be adopted. It is particularly obvious on LED fluorescent lamps.
The goal of high-speed growth has brought a steady flow of momentum to the company. Jingtai Optoelectronics has begun a non-stop expansion. According to the previous plan, this year the company will increase its monthly production capacity from 400KK last year to 600KK. However, in view of the ever-increasing volume of orders, the company has already completed its scheduled expansion target as early as June.
“The orders are constantly flowing, even if the capacity of 600KK is no longer satisfied. Jingtai Optoelectronics plans to expand 200KK, so the company's monthly production capacity will reach 800KK or more. The newly added capacity will be mainly invested in the rapid growth of LED lighting and automotive lighting devices. Gong Wen said that for the LED display device that the company started, Jingtai Optoelectronics will maintain the steady development of the display, but its share of the company's revenue contribution will gradually decline in the future.
LED display, LED lighting, 3C products (automotive lighting will be the main product in 3C products) are the company's three major development directions in the future. Gong Wen defines these three development directions as the “three troikas†that drive the company's rapid growth. .
At the 2012 High-Tech LED Show, Jingtai Optoelectronics will present its new MLCOB series this year - the third generation of MLCOB packaging products and medium power surface mount LEDs.
Among them, MLCOB adopts high-power packaging technology with ultra-low thermal resistance. Compared with traditional devices, MLCOB has high heat dissipation rate and effectively reduces light decay. It can optimize the application of lighting manufacturers, compact design and more flexible lighting design.
The medium-power surface-mount LED chip adopts high-power back-plating aluminum process, and the heat dissipation is more direct; the light-emitting area is large, the light-emitting angle is large, and the light is uniform; and the light transmittance of 10% is increased, and the light-transmitting cover of 85-95% can be adopted. It is particularly obvious on LED fluorescent lamps.
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