Transistor parameters

Fmax---the highest oscillation frequency. Operating frequency when the triode power gain is equal to one

hFE---common emitter quiescent current amplification factor

Hfe---common emitter small signal short-circuit voltage amplification factor

Hoe---common emitter small signal open output admittance

IB---the average value of the base DC current or AC current

Ic---the average value of the collector DC current or AC current

IE---the average value of the emitter DC current or AC current

Icbo---base grounding, emitter-to-ground open circuit, reverse-off current between collector and base under specified VCB reverse voltage conditions

Iceo---emitter grounded, base open to ground, reversed off current between collector and emitter under specified reverse voltage VCE

Iebo---base grounding, collector open to ground, reverse off current between emitter and base under specified reverse voltage VEB

Icer---the series resistance R between the base and the emitter, and the reverse off current between the collector and the emitter when the voltage VCE between the collector and the emitter is a prescribed value

Ices---the emitter is grounded, the base is shorted to ground, and the reverse off current between the collector and the emitter is under the specified reverse voltage VCE.

Icex---emitter grounded, with a specified bias between the base and emitter, reversed off current between collector and emitter at a specified reverse bias VCE

ICM---The maximum average value of the maximum allowable current or AC current of the collector.

IBM--the maximum value of the DC current that can continuously pass through the base, or the maximum average of the AC current, within the range of the collector's allowable power dissipation.

ICMP---collector maximum allowable pulse current

ISB---second breakdown current

IAGC---forward automatic control current

Pc---collector dissipation power

PCM---collector maximum allowable power dissipation

Pi---input power

Po---output power

Posc---oscillation power

Pn---noise power

Ptot---total dissipated power

ESB---second breakdown energy

Rbb''---base area extension resistance (base area intrinsic resistance)

Rbb''Cc---base-collector time constant, which is the product of the base extension resistance and the collector junction capacitance

Rie---Input resistance when the emitter is grounded and the AC output is short-circuited

Roe---emitter grounding, output resistance when the AC input is short-circuited under the specified VCE, Ic or IE, frequency conditions

RE---External emitter resistance (external circuit parameters)

RB---external base resistance (external circuit parameters)

Rc --- external collector resistance (outer circuit parameters)

RBE---External base-emitter resistance (external circuit parameters)

RL---load resistor (outer circuit parameters)

RG--- signal source internal resistance

Rth---thermal resistance

Ta---ambient temperature

Tc---shell temperature

Ts---junction temperature

Tjm---Maximum allowable junction temperature

Tstg---storage temperature

Td----delay time

Tr---rise time

Ts---storage time

Tf---fall time

Ton---opening time

Toff---off time

VCB---collector-base (DC) voltage

VCE---collector-emitter (DC) voltage

VBE---base emitter (DC) voltage

VCBO---base grounding, emitter-to-ground open circuit, maximum withstand voltage between collector and base under specified conditions

VEBO---base grounding, collector open to ground, maximum withstand voltage between emitter and base under specified conditions

VCEO---emitter grounded, base open to ground, maximum withstand voltage between collector and emitter under specified conditions

VCER---emitter grounding, series-to-emitter series resistance R, maximum voltage between collector and emitter under specified conditions

VCES---emitter grounding, base-to-ground short-circuit, maximum withstand voltage between collector and emitter under specified conditions

VCEX---the emitter is grounded, the specified bias voltage is applied between the base and the emitter, and the highest withstand voltage between the collector and the emitter under the specified conditions

Vp---punch voltage.

VSB---second breakdown voltage

VBB---base (DC) supply voltage (external circuit parameters)

Vcc---collector (DC) supply voltage (external circuit parameters)

VEE---emitter (DC) power supply voltage (external circuit parameters)

VCE(sat)---emitter grounding, specifying the collector-emitter saturation voltage drop under Ic, IB conditions

VBE(sat)---emitter grounding, specifying the base-emitter saturation voltage drop (forward voltage drop) under Ic and IB conditions

VAGC---forward automatic gain control voltage

Vn(pp)---the equivalent noise voltage peak at the input

V n---noise voltage

Cj---junction (interelectrode) capacitance, indicating the total capacitance of the é”—detection diode under the specified bias voltage across the diode

Cjv---bias junction capacitance

Co---zero bias capacitor

Cjo---zero bias junction capacitance

Cjo/Cjn---junction capacitance change

Cs---shell capacitor or package capacitor

Ct---total capacitance

CTV---voltage temperature coefficient. Ratio of relative change in steady voltage to absolute change in ambient temperature at test current

CTC---capacitor temperature coefficient

Cvn---nominal capacitance

IF --- Forward DC current (forward test current).é”—Detector diode passes the current between the poles under the specified forward voltage VF; the maximum operating current (average value) that the silicon rectifier and the silicon stack are allowed to pass continuously in the sine half wave under the specified use conditions, the silicon switch The maximum forward DC current that the diode is allowed to pass at rated power; the current given when the forward voltage parameter of the Zener diode is measured

IF(AV)---forward average current

IFM(IM)---forward peak current (forward maximum current). The maximum forward pulse current allowed through the diode at rated power. LED limit current.

IH---constant current, holding current.

Ii--- LED illuminating current

IFRM---forward repeat peak current

IFSM---positive peak current (surge current)

Io---rectifying current. Operating current through specified frequency and specified voltage conditions in a particular line

IF(ov)---forward overload current

IL---Photocurrent or steady current diode limiting current

ID---dark current

Base modulation current in IB2---single junction transistor

IEM---emitter peak current

IEB10---Reverse current between the emitter and the first base in a double-base single-junction transistor

IEB20---Emitter current in double base single junction transistor

ICM---Maximum output average current

IFMP---positive pulse current

IP---peak current

IV---valley current

IGT---thyristor gate trigger current

IGD---thyristor control pole does not trigger current

IGFM---control positive peak current

IR(AV)---reverse average current

IR (In) - reverse DC current (reverse leakage current). When measuring the reverse characteristic, the given reverse current; the silicon stack is in the sinusoidal half-wave resistive load circuit, the current passed when the reverse voltage is specified; the reverse polarity of the silicon switching diode plus the reverse operating voltage VR The current passed through; the leakage current generated by the Zener diode under reverse voltage; the leakage current of the rectifier at the highest reverse operating voltage of the sine half-wave.

IRM---reverse peak current

IRR---Thyristor Reverse Repeated Average Current

IDR---thyristor off-state average repeat current

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