[Text / high-tech LED reporter Zhou Jin] Due to the constant pressure on the price war of packaged devices, the price of packaging accessories has continued to decline, and material suppliers have become increasingly difficult to survive.
In addition, the changes in the packaging market pattern have also affected the expectations of material manufacturers to the market to a large extent. Some manufacturers are looking for ways to break through the market dilemma and find new profit growth points.
In particular, the new packaging technology is becoming more and more mature, and some material manufacturers are beginning to transform their packaging.
“At the same time as the supply of packaging materials, we also began to supply light source products.†Qian Xuexing, general manager of Shenzhen Chenri Technology Co., Ltd. (hereinafter referred to as “Crystal Technologyâ€) said in an interview.
Qian Xuexing said that with the company's previous advantages in solid crystal solder paste, under the opportunity of the maturity of flip-chip technology, the sales of accessories in the morning, especially the sales of flip-chip materials such as solid crystal solder paste, last year. At the same time, Qian Xuexing also wants to take the opportunity to extend to the downstream light source market.
Zhang Hongbiao, director of the High-tech LED Industry Research Institute (GLII), said that the packaging materials manufacturers that had been in the past few years have experienced a sharp decline in the price of packaged devices in recent years.
According to the survey data of the High-tech LED Industry Research Institute (GLII), the gross profit margin of most mainland LED packaging silicone companies can remain above 60% before and after 2011, and the packaging materials were once crowned as “high profitsâ€.
An industry analyst also said that in the past few years, the days of packaging materials companies have been nourished. Regardless of the profit of other links, the packaging materials factory can maintain a gross profit of no less than 40%-50%. “Some workshop-style factories in Zhongshan can purchase 516 kilograms of goods through regular channels when they buy 5,201 kilograms from regular manufacturers. The high profits are obvious, but nowadays, the scenery is no longer, packaging materials. The profit fell seriously."
The above analysts believe that this year's downstream lighting market should be the most optimistic period in history. Some small and medium-sized manufacturers with corresponding advantages will also be more involved in the terminal lighting market, trying to find new opportunities.
Qian Xuexing said that not all packaging materials manufacturers can smoothly transform, and the morning technology transformation flip-chip light source also depends on its own basic advantages.
Taking die-cast solder paste as an example, the die-bonding solder paste binds the flip chip to the pedestal to fix and conduct electricity. In the emerging flip-chip process, this is the key packaging material; in addition, due to the packaging material manufacturer It is necessary to have a good understanding of the packaging process and technical processes, which is also an advantage that can be extended to the downstream transformation in the morning.
At present, the capacity of flip-chip light source in the morning has reached a monthly capacity of about 3KK.
Zhang Hongbiao believes that the downstream lighting market is gradually opening up. As a midstream package that is most affected by upstream and downstream, the market changes are most uncertain this year, and this will also cause a large variation in the supply chain system of midstream packaging manufacturers. For material manufacturers, it is more common to take advantage of the opportunity to transform.
[Note: This article is the exclusive report of Gaogong LED . Please reprint the agreement in advance. For legal reprint, please refer to: Gaogong LED copyright maintenance - "Anti-infringement action" statement will be deemed to be illegally reprinted, this website will be held legally responsible! 】
In addition, the changes in the packaging market pattern have also affected the expectations of material manufacturers to the market to a large extent. Some manufacturers are looking for ways to break through the market dilemma and find new profit growth points.
In particular, the new packaging technology is becoming more and more mature, and some material manufacturers are beginning to transform their packaging.
“At the same time as the supply of packaging materials, we also began to supply light source products.†Qian Xuexing, general manager of Shenzhen Chenri Technology Co., Ltd. (hereinafter referred to as “Crystal Technologyâ€) said in an interview.
Qian Xuexing said that with the company's previous advantages in solid crystal solder paste, under the opportunity of the maturity of flip-chip technology, the sales of accessories in the morning, especially the sales of flip-chip materials such as solid crystal solder paste, last year. At the same time, Qian Xuexing also wants to take the opportunity to extend to the downstream light source market.
Zhang Hongbiao, director of the High-tech LED Industry Research Institute (GLII), said that the packaging materials manufacturers that had been in the past few years have experienced a sharp decline in the price of packaged devices in recent years.
According to the survey data of the High-tech LED Industry Research Institute (GLII), the gross profit margin of most mainland LED packaging silicone companies can remain above 60% before and after 2011, and the packaging materials were once crowned as “high profitsâ€.
An industry analyst also said that in the past few years, the days of packaging materials companies have been nourished. Regardless of the profit of other links, the packaging materials factory can maintain a gross profit of no less than 40%-50%. “Some workshop-style factories in Zhongshan can purchase 516 kilograms of goods through regular channels when they buy 5,201 kilograms from regular manufacturers. The high profits are obvious, but nowadays, the scenery is no longer, packaging materials. The profit fell seriously."
The above analysts believe that this year's downstream lighting market should be the most optimistic period in history. Some small and medium-sized manufacturers with corresponding advantages will also be more involved in the terminal lighting market, trying to find new opportunities.
Qian Xuexing said that not all packaging materials manufacturers can smoothly transform, and the morning technology transformation flip-chip light source also depends on its own basic advantages.
Taking die-cast solder paste as an example, the die-bonding solder paste binds the flip chip to the pedestal to fix and conduct electricity. In the emerging flip-chip process, this is the key packaging material; in addition, due to the packaging material manufacturer It is necessary to have a good understanding of the packaging process and technical processes, which is also an advantage that can be extended to the downstream transformation in the morning.
At present, the capacity of flip-chip light source in the morning has reached a monthly capacity of about 3KK.
Zhang Hongbiao believes that the downstream lighting market is gradually opening up. As a midstream package that is most affected by upstream and downstream, the market changes are most uncertain this year, and this will also cause a large variation in the supply chain system of midstream packaging manufacturers. For material manufacturers, it is more common to take advantage of the opportunity to transform.
[Note: This article is the exclusive report of Gaogong LED . Please reprint the agreement in advance. For legal reprint, please refer to: Gaogong LED copyright maintenance - "Anti-infringement action" statement will be deemed to be illegally reprinted, this website will be held legally responsible! 】
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