New electronic components are the focus of the development of the country and the information industry during the “Tenth Five-Year Planâ€. The whole machine is updated.
1 New electronic components are the key information industry developed during the “Tenth Five-Year Plan†period. The outline of the “Tenth Five-Year Plan†clearly stated: Chip-type, micro-miniaturized, multi-functional new component products, strengthen the development of new components and new display devices to meet the needs of the development of new-generation digital technology products. Expand production scale, increase variety, improve product technology and Quality and expanding exports have made our country a major producer and exporter of electronic components in the world. "
Therefore, strengthening the design and production of new electronic components is the top priority of the development of China's information industry during the 10th Five-Year Plan.
In order to promote the rapid development of China's new electronic components industry, the National Development Planning Commission decided to organize the implementation of new electronic components industrialization special projects from 2002, and its goals are: (1) According to China's new electronic component research and development Technical advantages and resource characteristics, focusing on supporting a batch of new electronic component products with high technical level and good market prospects, realizing industrial technology upgrades, and forming scale production as soon as possible. (2) During the "Tenth Five-Year Plan" period, a new electronic component industrial system with certain independent intellectual property rights and industrial advantages was initially formed. Through the focus on new electronic component products that have technical and resource advantages in China and are competitive in the international market Support and strive to enable the domestic new electronic components industry to meet the needs of various domestic industries and enter the international market during the Tenth Five-Year Plan period.
The special project is planned to be implemented in three years. For the project declared in 2002, after the expert review in April, the confirmed project was reviewed in feasibility report in August. The project to be reported in 2003 was reported to the State Planning Commission in October 2002. The provincial and municipal planning commissions and the national planning commission have attached great importance to the new electronic components special project.
Implemented in the State Economic and Trade Commission * 2002 National Key New Product Trial Production Plan "," 2002 National Key Technology Innovation Project "" Technological Innovation Fund for Small and Medium-sized Enterprises "implemented by the Ministry of Science and Technology The "Information Industry Development Fund" has given key support to new electronic components.
Joining the World Trade Organization (WTO) and participating in the Information Technology Agreement (ITA), the biggest opportunity for China's electronic information industry is to become the world's largest product processing base, and it must be the largest electronic component market. China's manufacturing industry is currently viewed from the total In 2000, the total output value reached 3.5 trillion yuan, more than 5% of the world's total, making it the fourth largest producer in the world. The production capacity is rapidly growing, and the proportion in the national economy has risen to 38.2%. It is estimated that China has the output of hundreds of manufactured products in the world, many of which are electronic products and products containing electronic technology. For example, 39.36 million color TV sets, accounting for 29%; 20 million VCD video players, accounting for 70%; 95.98 million telephone sets, 76.61 million electric fans, and 55.14 million cameras, all accounting for more than 50%; 45.9 million monitors, accounting for 42%; 1.5 billion watches, accounting for 75%; 14.43 million washing machines, accounting for 24%; 12.79 million refrigerators, accounting for 16%; 18.27 million air conditioners and 12.57 million microwave ovens, all accounting for more than 30%; etc. . Various types of printers and drivers, computer boards, mice and keyboards are also key production bases. The output of personal computers has reached 7.58 million units, while notebook computers only have a production capacity of 10 million units in Suzhou. It is expected that China's notebook computer output will also be the first in the world in the near future. China has become a major producer of household electronics and household appliances, and will march into the ranks of major producers of communications and computers. This has played a guiding and promoting role in the development of China's electronic components market and industry.
After joining the WTO and ITA, it will relax the access restrictions for foreign countries to enter the domestic market, and can carry out international cooperation on a larger scale, introducing advanced foreign technology, introducing foreign management, and absorbing foreign capital. At the same time, the current economic recession in many countries around the world and the unstable political situation have affected the development of their manufacturing industries. They transferred manufacturing to China. This is the biggest opportunity for China to establish an electronic machine processing base, and it must be the new electronic component market. The greatest opportunity for rapid development.
The rapid increase in production and rapid changes in performance have brought new opportunities for the development of new electronic components. Among the changes in global color TV, microcomputer and mobile phone production, mobile phones have the fastest growth rate, from 40 million in 1995 to The 410 million units in 2000 increased by more than 10 times in 5 years. The number of computers increased from 60 million in 1995 to 120 million in 2000, which has doubled in five years. This not only increases the matching amount of electronic components, but also puts forward new requirements for new electronic components from the perspective of the technological development of the whole machine. Such as mobile communications, satellite communications, optical communications, etc. are more and more developed to higher frequencies and larger bandwidths, such as 900MHz, 1800MHz, 2.4GHz mobile phone bands, and satellite communications use more than a dozen GHz frequency bands, while optical communications Bit rate development. Frequency characteristics become the most critical performance requirement, which is the basis of the market demand for new electronic components. Among the new electronic components organized and implemented by the State Planning Commission, high-frequency chip surface acoustic wave devices, RF radio frequency chip inductors, RF radio frequency composite circuits, miniature chip multilayer ceramic capacitors and other new electronic components have been supported. With the support of national special funds, the country has arranged special projects for mobile communications (mobile phones), including 39 component projects and 41 units. The Ministry of Finance and the Ministry of Information Industry arranged special funds of 148 million yuan, the State Planning Commission ’s national debt project arranged 170 million yuan, and the total size of the enterprise ’s supporting funds exceeded 2 billion yuan, which provided strong support for the development of new electronic components. .
New electronic components need to be developed and look for opportunities from challenges. Markets and technologies are developing. The market share of passive components with different package sizes is predicted: worldwide, the mainstream product of chip components in 2000 is type 0603. , Accounted for about 41.5%; 0402 type accounted for 32.5%, 0805 type accounted for 21%; by 2005, mainstream products will be 0402 type accounted for 45%, 0603 type reduced to 27.5%, 0805 type reduced to 11%, while 0201 type It accounts for 10%. The chip components currently produced in China are mainly 0805 type and 0603 type. Only a small number or joint ventures can produce 0402 type products, and 0201 type is still under development. In the special project of the State Planning Commission, chip capacitors, chip inductors, and chip resistors of type 0402 were mainly supported as products from 2002 to 2003. This is a challenge from a technical point of view and an opportunity from a development point of view. .
Bringing new opportunities for the development of the international market of electronic components China has become one of the main production bases of electronic components in the world. The products with the largest output in the world are speakers, recording heads, ferrite permanent magnets, quartz crystals Devices, aluminum electrolytic capacitors, micro motors, printed circuit boards, cylindrical nickel-cadmium batteries, cable TV radio frequency cables, etc. Products that are forming the world's main production base and export base include nickel-metal hydride batteries, photoelectric cables, capacitors, relays and other products. The common feature of their great development is that the products are exported well. According to analysis of relevant data, the export proportion of quartz crystal devices, aluminum electrolytic capacitors, and chip multilayer ceramic dielectric capacitors in 2000 was 73.2%, 74.8%, and 73.6%, respectively. In 2001, products with foreign exchange earnings of more than US $ 1 billion were electroacoustic. There are four categories of products: devices (US $ 1.595 billion), micro special motors (US $ 1.578 billion), printed circuits (US $ 1.520 billion), and electrical connectors (US $ 1.022 billion). If the product export situation is good, opportunities will be great and development will be fast.
6 Internationalization of the domestic market and internationalization of competition are new challenges in competition. According to China ’s commitment to join the WTO, before 2005, China will gradually abolish the import tariffs of all information technology products, which has accelerated the international market for China ’s domestic electronic components. Process of internationalization and competition. Out of market development, various multinational companies are vigorously pursuing localization strategies, and have established their own production bases in developing countries and regions through sole investment, joint ventures, and cooperation. They use China's vast consumer market, low labor costs, strong flexible production capacity and relatively complete industrial supporting facilities to build electronic components and complete machines in an industrial park, close to the market, and shift production. The original joint ventures were also capitalized to become a wholly foreign-owned or predominantly joint venture. This will pose the biggest threat to the original domestic enterprises.
According to relevant reports, since 1990, mainland China has absorbed 30 billion US dollars of foreign capital, accounting for 45% of the total in Asia. Among the Fortune 500, nearly 400 companies have invested in more than 2,000 projects in China.
According to reports, in 2001, the total industrial output value of the electronic components industry reached 40.7 billion yuan, of which 52% were foreign-invested enterprises, 16% were from Hong Kong, Macao and Taiwan-invested enterprises, and 14% were from state-owned enterprises. Other developed countries will continue to have electronic component factories relocating to mainland China, which will inevitably intensify competition in market share, and domestic enterprises are facing new challenges. What is more serious is that some international competition is gradually turning to the domestic market, causing the domestic market space to be continuously squeezed, market competition is further intensified, and merciless competition has brought product prices all the way down, causing some domestic companies to face strong international competitors. Is struggling.
The import of high-tech electronic components has increased sharply, which is a major challenge to the development of new electronic components in China. New electronic components are the foundation of the current and future information industry. Its rapid development and technical level have a direct impact on its development. The development of the entire information industry. Although China has formed a certain industrial foundation and has mastered large-scale production technologies and processes, there is still a considerable gap compared with the international development status. Such as 0402 type chip components, foreign countries are very mature products, except for domestic wholly foreign-owned and joint ventures, other companies are basically still in the initial stage, can not form industrial production, high-frequency, high-power and other technically demanding components It has also just entered the industrialization construction, and most of the core components, key raw materials, equipment and instruments in production still need to be imported. Besides, the situation of the transfer of multinational companies to China has undergone new changes, not only the transfer of production, but also an integrated transfer including R & D and sales. According to reports, in the past few years, world-renowned large companies have established more than 100 research and development centers in China. Murata, Japan ’s largest chip component manufacturer, Matsushita and Kyoto Ceramics, and South Korea ’s Samsung have all established joint ventures in China. Their strong technical and financial strength dominates the development direction of global passive components. They continue to expand the production scale and impact the domestic market, making international competition shift from resource and product competition to technology, brand, capital and market share competition. At the same time, with the demand for the development of machine technology, there is a shortage of new electronic components in China. For example, during the "Ninth Five-Year Plan" period, the direct import of electronic components increased from US $ 2.98 billion in 1995 to US $ 12.25 billion in 2000, with an average annual The rate is 32.7%, which has more than doubled in five years, and the value of imports and exports has been in deficit for four consecutive years. In 1999, the deficit was only $ 33 million, and it continued to expand to $ 3.37 billion in 2001. In the first half of 2002, there was already a deficit of US $ 1.211 billion. This is another challenge for China's new electronic components that are in the development stage.
8. The use of advanced and applicable technologies to transform and upgrade enterprises to make them bigger and stronger and increase market share is a question that every entrepreneur should consider. To sum up the past experience and lessons, the biggest mistake is to repeat yourself. The technological transformation of many enterprises is the "five originals", that is, the original place, the original product, the original process, the original cost level, and the original management. In the final analysis, it is the superposition of the old production lines, talking about repeating construction, only talking about others repeating, the actual biggest enemy is to repeat themselves and add chains for themselves.
In addition to the competition in the market, the competition of high-tech products, the competition of talents, and the credibility of competition, cost is becoming the focus of competition. When considering cost reduction, it is necessary to pay attention not only to its own cost, but also to Considering the reduction in production cost of the whole machine, one is to adapt to the inventory-free production of the whole machine and reduce logistics costs (including transportation). It is indeed a good way to be close to the market and close to the production of energy, resources, and low labor costs. It is also a good Method. The second is to improve the efficiency of the whole machine production and improve the utilization rate of component materials. Renovating and upgrading the industry with high-tech and advanced applicable technology is the road that every enterprise must take, regardless of cost, regardless of the pursuit of high, sophisticated and cutting-edge technology, we must pay attention to advanced and applicable technology. To follow: with structural adjustment as the main line, the core of transformation and upgrading is to optimize the industrial structure and upgrade the technical grade of products, so that the industrial development will enter the track of technological progress as the main long way as soon as possible; adhere to sustainable development; insist on cultivating enterprises Core competencies; adhere to close integration with system innovation and management innovation; adhere to the principle of combining independent innovation with imported technology.
In short, opportunities and challenges coexist. We must optimize the industrial structure and export product structure, strengthen scientific research and development, cultivate Chinese famous brands, implement large company strategies, and enhance the company's international competitiveness. Expand production scale, increase variety, improve product technology and quality, and expand exports, making China become the world's largest producer and exporter of electronic components.
(Editor: Shang Mu)
1.0mm (.039″) Pitch Pin Headers
Overview
Antenk offers a variety of high quality and competitively priced 1.0mm pitch single, dual, three, quad row pin (male) headers used in many board-to-board PCB connections, fitting small-sized, densely-packed devices.
This low-profile component is made from high-temperature thermoplastic and is offered with several means of connections and mounting styles such as through-hole (THM) or surface mount (SMT) and can be in vertical (straight), elevated or at a right angle configuration/orientation dissipating current of about 1.0 A or less.
The pin (male) header is generally mated with receptacle or stackable header connectors (female sockets). This types of pin headers are suitable for PCB board to board connection or for signal transmission application.
Applications of 1.0mm Pitch Pin Headers
Its small size is most suitable for PCB connections of small equipment and devices such as WiFi equipment, gaming consoles, measurement instruments, and other equipment in need of a special interface to become interconnected
Mount Type: Through-hole vs Surface Mount
At one side of this pin header is a series of pins which can either be mounted and soldered directly onto the surface of the PCB (SMT) or placed into drilled holes on the PCB (THM).
Through-Hole (Poke-In)
Best used for high-reliability products that require stronger connections between layers.
Aerospace and military products are most likely to require this type of mounting as these products experience extreme accelerations, collisions, or high temperatures.
Useful in test and prototyping applications that sometimes require manual adjustments and replacements.
1.0mm vertical single row header, 1.0mm vertical dual row header, 1.0mm Elevated single row pin header, 1.0mm Elevated dual row pin Header, 1.0mm Right-angle single row header and 1.0mm Right-angle dual row header are some examples of Antenk products with through-hole mount type.
Surface-Mount
The most common electronic hardware requirements are SMT.
Essential in PCB design and manufacturing, having improved the quality and performance of PCBs overall.
Cost of processing and handling is reduced.
SMT components can be mounted on both side of the board.
Ability to fit a high number of small components on a PCB has allowed for much denser, higher performing, and smaller PCBs.
1.0mm Right-angle Dual Row pin header, 1.0mm SMT Single row pin header, 1.0mm SMT Dual row pin header and 1.0mm Elevated Dual Row Pin Header are Antenk`s SMT pin headers.
Soldering Temperature for 1.0mm Pitch Pin Headers
Soldering SMT pin header can be done at a maximum peak temperature of 260°C for maximum 60 seconds.
Pin-Type: Vertical (Straight) and Right-Angle
1.0mm pitch headers may be further classified into pin orientation as well, such as vertical or straight male header or right-angle male header.
Vertical or Straight Pin (Male) Header Orientation
One side of the series of pins is connected to PCB board in which the pins can be at a right-angle to the PCB surface (usually called "straight" or [vertical") or.
Right-Angle Pin (Male) Header Orientation
Parallel to the board's surface (referred to as "right-angle" pins).
Each of these pin-types have different applications that fit with their specific configuration.
PCB Connector Stacking
Elevated Pin Header Orientation
Elevated pins aka Stacked Pins or Mezzanine are simply stacked pin headers providing an exact distance requirement between PCBs that optimizes electrical reliability and performance between PCB boards.
Profile Above PCB
This type of configuration is the most common way of connecting board-to-board by a connector. First, the stacking height is calculated from one board to another and measured from the printed circuit board face to its highest insulator point above the PCB.
Single, Dual or Multiple Number of Rows
For a 1.0mm straight or vertical male pin header, the standard number of rows that Antenk offers ranges from 1 to 2 rows. However, customization can be available if 3 ,4 or n number of rows is needed by the customer. Also, the number of contacts for the single row is about 2-50 pins while for dual row, the number contacts may vary from 4-100 pins.
Pin Material
The pins of the connector have been designed with copper alloy. With customer`s demand the pins can be made gold plated.
Breakaway design
The pin headers are also equipped with a breakaway design making them fully compatible with their female receptacles.
Custom 1.0mm Pitch Pin Headers
Customizable 1.0 mm pitch pin headers are also available, making your manufacturing process way faster as the pins are already inserted in the headers, insulator height is made at the right size and the accurate pin length you require is followed.
Parts are made using semi-automated manufacturing processes that ensure both precision and delicacy in handling the headers before packaging on tape and reel.
The tape and reel carrier strip ensures that the headers are packaged within accurately sized cavities for its height, width and depth, securing the headers from the environment and maintaining consistent position during transportation.
Antenk also offer a range of custom Tape and reel carrier strip packaging cavities.
Male Header Pins,1.0Mm Male Header,1.0Mm Pin Header,1.0Mm Male Header Pins, 1.0mm THM Male Header, 1.0mm SMT Male Header
ShenZhen Antenk Electronics Co,Ltd , https://www.pcbsocket.com