Texas Instruments (TI) today announced two fully integrated LED driver micromodules that eliminate the external components and complex layout issues common in LED driver designs. The 450 mA TPS92550 and TPS92551 DC/DC LED driver modules are the industry's first to integrate all required power and passive circuitry in a unified IC package, enabling up to 23 W of power for LEDs.
The 14 W TPS92550 and 23 W TPS92551 are constant current buck LED driver modules that require virtually no power supply design resources to simplify procurement, replacing four or more components with a single module. Together with TI's WEBENCH® LED architecture, lighting developers can quickly design power management circuits that drive up to 18 LED strings with a minimum of 96% power efficiency for fast, easy-to-use compact LEDs Lighting Design.
Key Features and Benefits of the TPS92550 and TPS92551 LED Driver Modules
· LED driver micromodules highly integrated inductors, Schottky diodes and some other passive components to simplify design and procurement;
· LED current can be adjusted from 300 mA to 450 mA to control brightness;
· Easy-to-use robust IC package provides excellent heat dissipation and immunity to electromagnetic interference (EMI) performance;
· Efficient heat dissipation of the micro module and back metal plate for smooth operation in high temperature environments;
· 10.16 mm x 9.85 mm x 4.57 mm compact package.
The 14 W TPS92550 and 23 W TPS92551 are constant current buck LED driver modules that require virtually no power supply design resources to simplify procurement, replacing four or more components with a single module. Together with TI's WEBENCH® LED architecture, lighting developers can quickly design power management circuits that drive up to 18 LED strings with a minimum of 96% power efficiency for fast, easy-to-use compact LEDs Lighting Design.
Key Features and Benefits of the TPS92550 and TPS92551 LED Driver Modules
· LED driver micromodules highly integrated inductors, Schottky diodes and some other passive components to simplify design and procurement;
· LED current can be adjusted from 300 mA to 450 mA to control brightness;
· Easy-to-use robust IC package provides excellent heat dissipation and immunity to electromagnetic interference (EMI) performance;
· Efficient heat dissipation of the micro module and back metal plate for smooth operation in high temperature environments;
· 10.16 mm x 9.85 mm x 4.57 mm compact package.
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